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this is information on a product in full production. october 2016 docid027664 rev 5 1/23 SPSGRF sub-ghz (868 or 915 mhz) low power programmable rf transceiver modules datasheet - production data features ? programmable radio features ? based on sub-1ghz spirit1 transceiver and integrated balun (balf-spi-01d3) ? modulation schemes: 2-fsk, gfsk, msk, gmsk, ook, ask ? air data rate from 1 to 500 kbps ? on-board antenna ? operating temperature range from -40 c to 85 c ? rf features ? receiver sensitivity: -118 dbm ? programmable rf output power up to +11.6 dbm ? host interface ?spi ? general i/o ? up to 32 programmable i/o functions on 4 gpio programmable module pins ? two typical carrier frequency versions: ? SPSGRF-868 with 868 mhz tuned antenna ? SPSGRF-915 with 915 mhz tuned antenna applications ? amr (automatic meter reading) ? home and building automation ? wsn (wireless sensor network) ? industrial monitoring and control ? wireless fire and security alarm systems ? point-to-point wireless link description the SPSGRF-868 and spsg rf-915 are easy-to- use, low power sub-ghz modules based on the spirit1 rf transceiver, ope rating respectively in the 868 mhz srd and 915 mhz ism bands. the modules provide a complete rf platform in a tiny form factor. the SPSGRF series enables wireless connectivity in electronic devices, requiring no rf experience or expertise for integration into the final product. as an fcc, ic, and ce certified solution, the SPSGRF series optimizes the time- to-market of end applications. the SPSGRF-915 is an fcc certified module (fcc id: s9nSPSGRF) and ic certified (ic 8976c- SPSGRF), while the spsg rf-868 is certified ce0051. the modules are designed for maximum performance in minimal space and include 4 programmable i/o pins and spi serial interfaces. www.st.com
contents SPSGRF 2/23 docid027664 rev 5 contents 1 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 SPSGRF module functional behavior . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 hardware specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3.1 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3.2 recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3.3 module current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3.4 module rf compliance limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3.5 SPSGRF module rf typical performance . . . . . . . . . . . . . . . . . . . . . . . . . 7 3.6 pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4 mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 5 hardware design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 5.1 reflow soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 6 regulatory compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 6.1 fcc certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 6.1.1 labeling instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 6.1.2 product manual instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 6.2 ic certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 6.2.1 labeling instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 6.2.2 product manual instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 6.3 ce certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 7 module traceability and marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 8 ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 9 ecopack ? . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 10 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
docid027664 rev 5 3/23 SPSGRF block diagram 23 1 block diagram figure 1. SPSGRF block diagram
SPSGRF module functi onal behavior SPSGRF 4/23 docid027664 rev 5 2 SPSGRF module functional behavior the spirit1 device in the SPSGRF module is equipped with a built-in main controller which controls the switching between the two main operating modes: transmit (tx) and receive (rx). in shutdown condition, the spsg rf module can be switched on/off with the external sdn pin; all other functions/regi sters/commands are available th rough the spi interface and gpios. no internal supply is generated (in order to minimize battery leakage), and therefore all stored data and configurations are lost. the gpio and spi ports of the module during shutdown are in hiz. from the shutdown state, the SPSGRF module can be switched on from the s dn pin and goes into a ready state, which is the default, where the reference signal from xo is available. from the ready state, the SPSGRF module ca n be moved to a lock state to generate the high precision lo signal and/or tx or rx modes. switching from rx to tx and vice- versa can occur only by passing through the lock state. this operation is normally managed by radio control with a single user command (tx or rx). at the end of the events above, the SPSGRF module can return to its default state (ready) and can then be put into a sl eep condition (sleep state), char acterized by very low power consumption. if no timeout is required, the SPSGRF modu le can be moved from ready to standby state, which has the lowest possible current consumption while retaining fifo, status and configuration registers. to manage the tran sitions towards and between these operating modes, the controller works as a state machine, the state switching of which is driven by spi commands. figure 2. module functional state transitions diagram
docid027664 rev 5 5/23 SPSGRF hardware specifications 23 3 hardware specifications 3.1 absolute maximum ratings general conditions (v in = 3.3 v and 25 c) 3.2 recommended operating conditions 3.3 module current consumption table 1. absolute maximum ratings rating min. typ. max. unit storage temperature range -40 +85 c supply voltage, v in -0.3 3.9 v i/o pin voltage -0.3 3.9 v rf saturation input power +10 dbm table 2. recommended operating conditions rating min. typ. max. unit operating temperature range -40 +85 c supply voltage, v in 1.8 3.3 3.6 v signals & i/o pin voltage (according supply voltage) 1.8 3.6 v rf frequency bandwidth (SPSGRF-868) 863 870 mhz rf frequency bandwidth (SPSGRF-915) 902 928 mhz table 3. SPSGRF-868 module symbol parameter test conditions typ. unit i dd supply current operating mode tx, +11.6 dbm, 2-fsk, 868 mhz 22 ma operating mode tx, - 7 dbm, 2-fsk, 868 mhz 9ma operating mode rx, 868mhz 10 ma command mode 0.6 ma shutdown high level -v dd (with other i/o in high impedance) 0.1 a
hardware specifications SPSGRF 6/23 docid027664 rev 5 3.4 module rf compliance limits the rf compliance limits are those tested fo r fcc, ic and ce certification using the dedicated dongle (pc92a.v01). these limits are enforced by the dongle firmware. care must be taken with custom application firmware to ensure these limits are not exceeded, voiding the fcc, ic and ce certification. table 4. SPSGRF-915 module symbol parameter test conditions typ. unit i dd supply current operating mode tx, +11.6 dbm, 2-fsk, 915 mhz 22 ma operating mode tx, - 7 dbm, 2-fsk, 915 mhz 9ma operating mode rx, 915 mhz 10 ma command mode 0.6 ma shutdown high level -v dd (with other i/o in high impedance) 0.1 a table 5. rf compliance limits table modulation standards parameter max. unit 2-fsk gfsk msk fcc part 15.207 (1) fcc part 15.247 (1) ic rss-210 en 300 220-2 v2.4.1 (2) en 301 489-01 v1.9.2 (2) en 301 489-03 v1.4.1 (2) 1. fcc and ic standards are applicabl e only to the SPSGRF-915 module. 2. en standards are applicable onl y to the SPSGRF-868 module. data rate 500 kbps output power +11.6 dbm ook ask fcc part 15.207 (1) fcc part 15.247 (1) ic rss-210 en 300 220-2 v2.4.1 (2) en 301 489-01 v1.9.2 (2) en 301 489-03 v1.4.1 (2) data rate 250 kbps output power +6 dbm
docid027664 rev 5 7/23 SPSGRF hardware specifications 23 3.5 SPSGRF module rf typical performance the rf performance of the SPSGRF-868 and SPSGRF-915 mo dules are dependent on many factors, related to the customer hardware application board where the module is connected and also to the customer applicatio n firmware. in order to provide some basic information to the customer integrating the mo dule, it may be useful to provide the rf measurements taken in an anechoic chamber using a dongle containing a connected SPSGRF-868 or spsg rf-915 module. table 6. SPSGRF-868 or 915 modul es radiated typical performance symbol parameter test conditions typ. unit tx rf power rf radiated power operating mode tx, +11.6 dbm, 2-fsk, 868,0-868,6 mhz +5.3 dbm operating mode tx, +11.6 dbm, 2-fsk, 902-928 mhz +2.2 dbm
hardware specifications SPSGRF 8/23 docid027664 rev 5 table 7. SPSGRF-868 or 915 module conducted typical performance before the rf antenna circuits (positive rf power signal values measured) parameter tes t conditions (1) conducted programmable value measured conducted value typ. unit tx rf conducted power (before the antenna circuits) tx, +11.6 dbm, 2-fsk, 868 mhz tx, +11.6 dbm, 2-fsk, 915 mhz +11.6 +11.2 dbm tx, +11 dbm, 2-fsk, 868 mhz tx, +11 dbm, 2-fsk, 915 mhz +11.0 +10.8 dbm tx, +10 dbm, 2-fsk, 868 mhz tx, +10 dbm, 2-fsk, 915 mhz +10.0 +9.7 dbm tx, +9 dbm, 2-fsk, 868 mhz tx, +9 dbm, 2-fsk, 915 mhz +9.0 +8.5 dbm tx, +8 dbm, 2-fsk, 868 mhz tx, +8 dbm, 2-fsk, 915 mhz +8.0 +7.6 dbm tx, +7 dbm, 2-fsk, 868 mhz tx, +7 dbm, 2-fsk, 915 mhz +7.0 +7.2 dbm tx, +6 dbm, 2-fsk, 868 mhz tx, +6 dbm, 2-fsk, 915 mhz +6.0 +6.2 dbm tx, +5 dbm, 2-fsk, 868 mhz tx, +5 dbm, 2-fsk, 915 mhz +5.0 +5.4 dbm tx, +4 dbm, 2-fsk, 868 mhz tx, +4 dbm, 2-fsk, 915 mhz +4.0 +4.0 dbm tx, +3 dbm, 2-fsk, 868 mhz tx, +3 dbm, 2-fsk, 915 mhz +3.0 +3.1 dbm tx, +2 dbm, 2-fsk, 868 mhz tx, +2 dbm, 2-fsk, 915 mhz +2.0 +2.1 dbm tx, +1 dbm, 2-fsk, 868 mhz tx, +1 dbm, 2-fsk, 915 mhz +1.0 +1.2 dbm tx, +0 dbm, 2-fsk, 868 mhz tx, +0 dbm, 2-fsk, 915 mhz +0.0 +0.6 dbm 1. operating mode
docid027664 rev 5 9/23 SPSGRF hardware specifications 23 table 8. SPSGRF-868 or 915 module conducted typical performance before the rf antenna circuits (negative rf power signal values measured) parameter tes t conditions (1) conducted programmable value measured conducted value typ. unit tx rf conducted power (before the antennas circuits) tx, -1 dbm, 2-fsk, 868 mhz tx, -1 dbm, 2-fsk, 915 mhz -1.0 -1.1 dbm tx, -2 dbm, 2-fsk, 868 mhz tx, -2 dbm, 2-fsk, 915 mhz -2.0 -2.3 dbm tx, -3 dbm, 2-fsk, 868 mhz tx, -3 dbm, 2-fsk, 915 mhz -3.0 -3.4 dbm tx, -4 dbm, 2-fsk, 868 mhz tx, -4 dbm, 2-fsk, 915 mhz -4.0 -4.9 dbm tx, -5 dbm, 2-fsk, 868 mhz tx, -5 dbm, 2-fsk, 915 mhz -5.0 -5.8 dbm tx, -6 dbm, 2-fsk, 868 mhz tx, -6 dbm, 2-fsk, 915 mhz -6.0 -6.9 dbm tx, -7 dbm, 2-fsk, 868 mhz tx, -7 dbm, 2-fsk, 915 mhz -7.0 -6.5 dbm tx, -8 dbm, 2-fsk, 868 mhz tx, -8 dbm, 2-fsk, 915 mhz -8.0 -7.3 dbm tx, -9 dbm, 2-fsk, 868 mhz tx, -9 dbm, 2-fsk, 915 mhz -9.0 -8.2 dbm tx, -10 dbm, 2-fsk, 868 mhz tx, -10 dbm, 2-fsk, 915 mhz -10.0 -9.7 dbm tx, -15 dbm, 2-fsk, 868 mhz tx, -15 dbm, 2-fsk, 915 mhz -15.0 -14.6 dbm tx, -20 dbm, 2-fsk, 868 mhz tx, -20 dbm, 2-fsk, 915 mhz -20.0 -19.2 dbm tx, -25 dbm, 2-fsk, 868 mhz tx, -25 dbm, 2-fsk, 915 mhz -25.0 -23.3 dbm tx, -30 dbm, 2-fsk, 868 mhz tx, -30 dbm, 2-fsk, 915 mhz -30.0 -26.2 dbm tx, -35 dbm, 2-fsk, 868 mhz tx, -35 dbm, 2-fsk, 915 mhz -35.0 -27.8 dbm 1. operating mode
hardware specifications SPSGRF 10/23 docid027664 rev 5 3.6 pin connections figure 3. pin connection diagram table 9. pin assignment name type pin# description alt function v max. tolerance initial state spi interface spi_clk i 7 spi clock (max. 8 mhz) v in spi_miso o 8 spi miso (master in / slave out) v in spi_mosi i 9 spi mosi (m aster out slave in) v in spi_cs i 10 spi ?chip select? (spi slave select) v in power and ground v in 5v in (1.8v - 3.6v max.) gnd 6 gnd module shutdown sdn i 11 shutdown input (active high) (1.8v - 3.6v max.) gpio - general purpose input/output gpio [0] i/o 4 programmable input / output & analog temperature output (1.8v - v in max.) digital output. low power gpio [1] i/o 3 programmable input / output (1.8v - v in max.) digital output. low power gpio [2] i/o 2 programmable input / output (1.8v - v in max.) digital output. low power gpio [3] i/o 1 programmable input / output (1.8v - v in max.) digital output. low power
docid027664 rev 5 11/23 SPSGRF mechanical dimensions 23 4 mechanical dimensions figure 4. mechanical dimensions figure 5. recommended land pattern
hardware design SPSGRF 12/23 docid027664 rev 5 5 hardware design the SPSGRF module supports spi hardware interfaces. note: - all unused pins should be left floating; do not ground. - all gnd pins must be well grounded. - the area around the module should be free of any ground planes, power planes, trace routings, or metal for 6 mm from the module antenna position, in all directions. - traces should not be routed underneath the module 5.1 reflow soldering the SPSGRF is a surfac e mount sub-1 ghz transceiver mo dule supplied on an 11 pin, 4- layer pcb. the final assembly recommend ed reflow profiles are indicated below. the soldering phase must be executed with care. in order to avoid an undesired melting phenomenon, particular attention should be given to the setup of the peak temperature. table 10 provides suggestions for the temperat ure profile based on ipc/jedec j-std- 020c, july 2004 recommendations. table 10. soldering recommendations profile feature pb-free assembly average ramp up rate (t smax to t p ) 3c/ sec max preheat temperature min (t s min) 150 c temperature max (t s max) 200 c time (t s min to t s max) (t s ) 60-100 sec time maintained above: temperature t l 217 c time t l 60-70 sec peak temperature (t p )240 + 0 c time within 5 c of actual peak temperature (t p ) 10-20 sec ramp down rate 6 c/sec time from 25 c to peak temperature 8 minutes max
docid027664 rev 5 13/23 SPSGRF hardware design 23 figure 6. soldering profile
regulatory co mpliance SPSGRF 14/23 docid027664 rev 5 6 regulatory compliance 6.1 fcc certification the SPSGRF-915 module has been test ed and found compliant wit h the fcc part 15 rules. these limits are designed to provide reasonable protection against harmful interference in approved installations. this equipment gener ates, uses, and can radiate radio frequency energy and, if not installed and used in accord ance with the instructions, may cause harmful interference to radio communications. however, there is no guarantee that interference may not occur in a particular installation. this device complies with part 15 of the fcc ru les. operation is subject to the following two conditions: (1) this device may not cause ha rmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. modifications or changes to this equipment not expressly approved by stmicroelectronics may render void the user's authority to operate this equipment. modular approval fcc id: s9nSPSGRF in accordance with fcc part 15, the SPSGRF-9 15 is listed as a modular transmitter device. this module is evaluated for stand-alone use only. finished products incorporating multiple transmitters must comply with collocation and rf exposure requirements in accordance with fcc multi-transmitter product procedures. collocated transmitters operating in portable rf exposure conditions (e.g. <20 cm from persons including but not limited to body worn and hand-held devices) may require separate approval. 6.1.1 labeling instructions when integrating the SPSGRF-915 into the final product, th e oem must ensure that the fcc labeling requirements are satisfied. a statement must be included on the exterior of the final product which indicates that the product includes a certified module. the label should state the following (or similar wording that conveys the same meaning): the oem must include the following statements on the exterior of the final product unless the product is too small (e.g. less than 4 x 4 inches): this device complies with part 15 of the fcc ru les. operation is subject to the following two conditions: 1. this device may not cause harmful interference 2. this device must accept any interference received, including any interference that may cause undesired operation. contains fcc id: s9nSPSGRF or this product contains fcc id: s9nSPSGRF
docid027664 rev 5 15/23 SPSGRF regulatory compliance 23 6.1.2 product manual instructions this section applies to oem fi nal products containing the SPSGRF-915 module , subject to fcc compliance. the final product manual must contain the following statement (or a similar statement that conveys the same meaning): ?warning: changes or modifications not expre ssly approved by the party responsible for compliance could void the user's authority to operate the equipment. (part. 15.21)? in the case where an oem seeks class b (residential) limits for the final product, the following statement must be included in the final product manual: ?note: this equipment has been tested and found to comply with the limits for a class b digital device, pursuant to part 15 of the fcc rules. these limits are designed to provide reasonable protection against harmful interference in a residential installation. this equipment generates, uses and can radiate radi o frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. however, there is no guarantee that interference will not occur in a particular installation. if this equipment d oes cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: ? reorient or relocate the receiving antenna. ? increase the separation between the equipment and receiver. ? connect the equipment into an outlet on a circuit different from that to which the receiver is connected. ? consult the dealer or an experienced radio/tv technician for help.? in the case where an oem seeks the lesser cate gory of a class a digital device for the final product, the following statement must be included in the final product manual: ?note: this equipment has been tested and found to comply with the limits for a class a digital device, pursuant to part 15 of the fcc rules. these limits are designed to provide reasonable protection against harmful interfer ence when the equipment is operated in a commercial environment. this equipment generat es, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. op eration of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his expense.? 6.2 ic certification the SPSGRF-915 module has been tested and found compliant with the ic rss-210 rules. these limits are designed to provide reasonable protection against harmful interference in approved installations. this equipment gener ates, uses, and can radiate radio frequency energy and, if not installed and used in acco rdance with the instruct ions, may cause harmful interference to radio communications. however, there is no guarantee that interferen ce may not occur in a pa rticular installation. this device complies with rss-210 of the ic ru les. operation is subject to the following two conditions: (1) this device may not cause harmf ul interference, and (2) this device must accept any interference received, includin g interference that may cause undesired operation.
regulatory co mpliance SPSGRF 16/23 docid027664 rev 5 modifications or changes to this equipment not expressly approved by stmicroelectronics may render void the user's authority to operate this equipment. modular approval ic: 8976c-SPSGRF in accordance with ic rss-2 10, the SPSGRF-915 is listed as a modular transmitter device. this module is evaluated for stand-alone use only. finished products incorporating multiple transmitters must comply with collocation and rf exposure requirements in accordance with ic multi-transmitter product procedures. collocated transmitters operating in portable rf exposure conditions (e.g. <20 cm from persons including but not limited to body worn and hand-held devices) may require separate approval. 6.2.1 labeling instructions when integrating the SPSGRF-915 into the final product, the oem must ensure that the ic labeling requirements are satisfied. a statement mu st be included on the exterior of the final product which indicates that the product includ es a certified module. the label should state the following (or similar wording th at conveys the same meaning): the oem must include the following statements on the exterior of the final product unless the product is too small (e.g. less than 4 x 4 inches): ?this device complies with rss-210 of the ic rules. operation is su bject to the following two conditions: 1. this device may not cause harmful interference 2. this device must accept any interference received, including any interference that may cause undesired operation.? 6.2.2 product manual instructions this section applies to oem fi nal products containing the SPSGRF-915 module, subject to ic compliance. the final product manual must contain the following statement (or a similar statement that conveys the same meaning): ?warning: changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. (rss-210)? in the case where an oem seeks class b (residential) limits for the final product, the following statement must be included in the final product manual: ?note: this equipment has been tested and found to comply with the limits for a class b digital device, pursuant to rss-210 of the ic rules. these limits are designed to provide reasonable protection against harmful interf erence in a residential installation. this equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. however, th ere is no guarantee that in terference will not occur in a particular installation. if this equipment does cause harmful interference to radio or contains ic id: 8976c-SPSGRF or this product contai ns ic id: 8976c-SPSGRF
docid027664 rev 5 17/23 SPSGRF regulatory compliance 23 television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: ? reorient or relocate the receiving antenna. ? increase the separation between the equipment and receiver. ? connect the equipment into an outlet on a circuit different from that to which the receiver is connected. ? consult the dealer or an experienced radio/tv technician for help.? in the case where an oem seeks the lesser cate gory of a class a digital device for the final product, the following statement must be included in the final product manual: ?note: this equipment has been tested and found to comply with the limits for a class a digital device, pursuant to rss-210 of the ic rules. these limits are designed to provide reasonable protection against harmful interfer ence when the equipment is operated in a commercial environment. this equipment gener ates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his expense.? 6.3 ce certification the SPSGRF-868 module has been certified according to the following standards: ? en 300 220-2 v2.4.1 ? en 301 489-01 v1.9.2 ? en 301 489-03 v1.4.1 ? en60950-1:2006 + a11:2009 + a1:2010 + a12:2011 the module is ce certified:
module traceability and marking SPSGRF 18/23 docid027664 rev 5 7 module traceability and marking the SPSGRF bottom-side label cont ains the following information: ? model: ?model: SPSGRF-915? indicati ng the SPSGRF rf module family ? fcc usa certification identif ication number: ?fccid:s9nSPSGRF ?. this code is valid only for 915 mhz frequency band ? ic canada certification number: ?ic: 8976c -SPSGRF?. this code is used only for the canadian market ? 2d laser data matrix figure 7. SPSGRF bottom side each module is univocally identified by se rial number stored in a 2d laser data matrix marked on the bottom of the module. the figure below shows the standard bottom-side qr-code laser marking. figure 8. SPSGRF qr-c ode laser marking
docid027664 rev 5 19/23 SPSGRF module traceabi lity and marking 23 the serial number has the following format: ww yy k pp nnn where: ? ww - week ? yy - year ? k - product id (refer to table 11 below) ? pp - internal st use only ? nnn - internal st use only each module bulk package is identified by a bulk id. the bulk id and module 2d data matrix are linked by a reciprocal traceability link. the module 2d data matrix traces the lot number of any raw material used. table 11. module product id k product family identification w SPSGRF-868 x SPSGRF-915
ordering information SPSGRF 20/23 docid027664 rev 5 8 ordering information table 12. ordering information order code description packing moq SPSGRF-868 868 mhz spirit1 transceiver module (region 1, europe) jedec tray 2448 pcs SPSGRF-915 915 mhz spirit1 transce iver module (region 2, the americas) jedec tray 2448 pcs
docid027664 rev 5 21/23 SPSGRF ecopack ? 23 9 ecopack ? in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions a nd product status are available at: www.st.com . ecopack ? is an st trademark.
revision history SPSGRF 22/23 docid027664 rev 5 10 revision history table 13. document revision history date revision changes 31-mar-2015 1 initial release. 14-apr-2015 2 updated features and description in cover page. 22-may-2015 3 updated description in cover page. 29-jun-2016 4 ? added marking and module identification details in section 7: module traceability and marking . ? updated figure 5: recommended land pattern 17-oct-2016 5 corrected typographical e rror in part number SPSGRF- 915 in the features and description sections of the coverpage.
docid027664 rev 5 23/23 SPSGRF 23 important notice ? please read carefully stmicroelectronics nv and its subsidiaries (?st?) reserve the right to make changes, corrections, enhancements, modifications, and improvements to st products and/or to this document at any time without notice. purchasers should obtain the latest relevant in formation on st products before placing orders. st products are sold pursuant to st?s terms and conditions of sale in place at the time of o rder acknowledgement. purchasers are solely responsible for the choice, selection, and use of st products and st assumes no liability for application assistance or the design of purchasers? products. no license, express or implied, to any intellectual property right is granted by st herein. resale of st products with provisions different from the information set forth herein shall void any warranty granted by st for such product. st and the st logo are trademarks of st. all other product or service names are the property of their respective owners. information in this document supersedes and replaces information previously supplied in any prior versions of this document. ? 2016 stmicroelectronics ? all rights reserved

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